InvenSense MOD-1600 Temperature Stabilized Module Improves Product Performance by Eliminating Temperature Variation Effects on 6-Axis Motion Sensor
SAN JOSE: InvenSense Inc. (NYSE: INVN), a leading provider of MEMS sensor platform solutions, today announced the MOD-1600, the industry smallest 6-axis integrated MEMS (3-axis accelerometer + 3-axis gyroscope) temperature stabilized motion tracking module ideally suited for drones, head mount display devices (HMD) and Internet of Things (IoT) application, enabling superior OEM product performance. The MOD-1600 is a module delivering extremely stable gyroscope and accelerometer output that removes the need and complexity of constant sensor calibration due to temperature variations, caused by changes in internal and external operating conditions.
The InvenSense MOD-1600 consists of a patent-pending algorithm and packaging process, which delivers and maintains a constant operating temperature within 0.2 degree C, eliminating the need for sensor data calibration due to temperature variation. The MOD-1600 module is offered in a 13 mm x 8 mm x 4 mm, 16 pin package.
“InvenSense’s first temperature stabilized module disrupts the landscape of traditional discrete sensors designed specifically for the high performance applications, such as drones, HMD devices, and IoT products,” said Eitan Medina, vice president marketing and product management at InvenSense. “By removing and creating immunity to the temperature variation using the patent-pending software algorithms and packaging methodology, InvenSense’s MOD-1600 6-axis module delivers a superior sensor performance needed for the always improving implementation requirements of OEMs platforms.”
The InvenSense MOD-1600 module is available for sampling in 1Q of CY2016. InvenSense is exhibiting in booth #36217 in South Hall 4 at the 2016 Consumer Electronics Show taking place in Las Vegas, Nevada from January 6 – 9, 2016.
InvenSense, Inc. (NYSE: INVN) is the world’s leading provider of MEMS sensor platforms. The company’s patented InvenSense Fabrication Platform and MotionFusion® technology address the emerging needs of many mass-market consumer applications via improved performance, accuracy, and intuitive motion-, gesture- and sound-based interfaces. InvenSense technology can be found in Mobile, Wearables, Smart Home, Industrial, and Automotive products. InvenSense is headquartered in San Jose, California and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia and Italy.